Tritek Circuit Products

The chemical solutions listed in the following pages are our most popular chemistry being used in the industry.  Should there be a solution which you are looking for and is not found in the following pages, please feel free to call us and ask for any information.  

Making Holes Conductive

Developer

Resolve 211 is a concentrated aqueous photoresist developer system with many advantages over potassium carbonate alone.  Resolve 211 contains water softening agents to prevent the accumulation of water hardness scale in processing equipment and detergents to break up and prevent the build-up of resist "scum."  Resolve 211 can significantly improve process yields specially when used in tandem with an automatic developer controller such as the Tektroller AQ-80.

Desmear

Circuposit® Promoter 3308 is the second step in Shipley's unique, patented Circuposit 3000 PTH Process, which defines a new standard for through-hole-plating.  Circuposit® Promoter 3308  is a replenishable alkaline permanganate bath which effectively removes drill smear and debris while texturizing remaining resin surfaces to ensure consistently superior coverage, adhesion and solderability.

Circuposit®  Conditioner 3320 is an integral part of the Circuposit 3000 PTH Process, Shipley Ronal's unique, patented process that defines a new standard for through-hole plating.  This unique, mildly-acidic conditioner effectively conditions all hole-wall surfaces.

Preposit®  Etch 748 is a mildly acidic micro-etch which promotes excellent copper innerlayer adhesion.  Unlike other persulfate based micro-etch systems, baths prepared from Preposit Etch 748 are stable and active for considerable longer periods of time with consistent etch rates.

Cataprep®  404 Pre-Dip is specially formulated for use with the Cataposit® 44 Catalyst bath.  Cataprep® 404 Pre-Dip is used both in the makeup of the catalyst bath and as a pre-dip to protect the catalyst from harmful drag-in and thus maintain its superior performance and extend its life.

Cataposit® 44 Catalyst is a patented , tin-palladium colloidal catalyst that is specially formulated to seed the nonconductive surfaces of printed circuit boards for complete and uniform deposition of Shipley Cuposit® Electroless Coppers.  It is mildly acidic, chloride containing catalyst which is nonvolatile and nonfuming.

Cuposit® Accelerator 19 is a key step in Shipley's P-T-H (plated-through-hole) Process.  It's important function is to modify absorbed catalyst to allow quick and uniform metal deposition.

Cuposit® Accelerator 19 promotes strong copper-to-copper bonds, and protects the electroless copper bath from potentially harmful catalyst drag-in.

Cuposit® 328L Copper Mix was developed to ensure the production of reliable plated-through-holes.  It produces good coverage even on hard to plate substrates.  Cuposit® 328L Copper Mix yields deposits that are smooth, fine grained and uniform in color.  

Cuposit® 328L Copper Mix deposits 15-20 millionths of an inch of a deep pink copper deposit, which is suitable for flash panel plate with an acidic copper electroplating bath.

Cuposit® 250 Electroless Copper was specially developed to produce plated-through-holes of the highest quality.  Formulated to provide improved physical properties, Cuposit® 250 Electroless Copper produces exceptionally fine grain, low stress deposits which yield enhanced hole-wall coverage, and excellent adhesion on even the most demanding high performance substrates.

Cuposit® 250 Electroless Copper has a wide operating window, and offers exceptional stability.  As a result , the bath is easy to operate and maintenance costs are reduced.  In addition, the Cuposit® 250 Electroless Copper bath is based upon EDTA and thus especially easy to waste treat.

Cuposit® 250 Electroless Copper yields deposits that are smooth, bright, uniform in color, and low in stress.  At a temperature of 110°-120° F, Cuposit® 250 Electroless Copper will deposit 50 - 60 millionths of an inch in 30 minutes.

Circuposit® Electroless Copper 3350 is an integral part of the Circuposit 3000 PTH Process, Shipley's unique, patented process which defines a new standard for through-hole-plating.  This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality control.

Circuposit® Electroless Copper 3350 was specially developed to produce plated-through-holes of the highest quality.  Formulated to provide improved physical properties, Circuposit® Electroless Copper 3350  produces exceptionally fine grain, low stress deposits which yield enhanced hole-wall coverage, and excellent adhesion on even the most demanding high performance substrates.

Circuposit® Electroless Copper 3350 has a wide operating window, and offers exceptional stability.  As a result , the bath is easy to operate and maintenance costs are reduced.  In addition, the Circuposit® Electroless Copper 3350  bath is based upon EDTA and thus especially easy to waste treat.  Cuposit® 250 Electroless Copper yields deposits that are smooth, bright, uniform in color, and low in stress.  At a temperature of 110°-120° F, Circuposit® Electroless Copper 3350  will deposit 80 millionths of an inch in 25 minutes.

Anti-Tarnish 7130 is designed for use prior to the inner layer or outer layer imaging processes.  It has excellent bath life and provides a long lasting anti-tarnish effect.  It is also used prior to optical inspection to reduce false readings.

The Shipley Electroposit® 1100 Acid Copper plating additive is designed for reliable through hole plating of conventional printed circuit boards.  Use of the additive can significantly increase productivity while providing excellent leveling, surface distribution, and throwing power when plating through hole aspect ratios up to 10:1.

Copper Gleam 2001 is a development in acid copper electroplating technology designed to produce high reliability through-hole copper interconnections in standard and advanced printed circuit board designs.

Specifically, Copper Gleam 2001 provides uniform, bright, ductile copper deposits over the range of operating conditions required to optimize throwing power, thickness distribution and productivity.

The excellent thickness distribution and quality of deposits that the technology provides makes Copper Gleam 2001 particularly suitable for use in the through-hole copper electroplating of high aspect ratio boards.

CuOx 310 is a chemical regenerant used to oxidize cuprous chloride to cupric chloride in cupric chloride etchants.   CuOx 310  replaces chlorine gas in most cupric chloride etching applications.  It is much safer to use than chlorine gas and is designed for use with the TEKtroller CC-305 automatic cupric chloride etchant control system.

CuOx 313 is a chemical regenerant used to oxidize cuprous chloride to cupric chloride in cupric chloride etchants.   CuOx 313 includes proprietary banking agents that improve the etch speed of copper and iron alloys by 15% over commodity sodium chlorate regeneration.  CuOx 313 replaces chlorine gas in most cupric chloride etching applications and increases the etching speed by 25%.  It is much safer to use than chlorine gas and is designed for use with the automatic cupric chloride etchant control system, TEKtroller CC-305.

          Circubond

Circubond is a specially formulated, simple, three-step process designed primarily to enhance the innerlayer adhesion of multilayer printed wiring boards.  It can be used in the horizontal conveyorized or vertical dip mode.  The Circubond Treatment 180 is  a peroxide-sulfuric based etch, formulated to produce uniform, highly textured and passivated brown coating on copper innerlayers.  This surface provides excellent adhesion promotion in subsequent lamination processing to enhance MLB integrity.

SurfaceStrip 446  Inners

SurfaceStrip 448  Outers

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